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PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

TONGZHAN INDUSTRIAL LIMITED
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PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

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Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : T/T

Supply Ability : 100000pc/Month

Delivery Time : 4 Weeks

Packaging Details : PCB + Box

Brand Name : CUSTOM MADE

Certification : ISO/UL

Keyword : PCB Layout Design

PCB Board : Multi-Layer Boards, Rigid-Flex Boards

Applications : Consumer Electronics, Automotive Electronics, Communications, Internet

Surface Finished : HASL, HASL Pb Free Immersion Gold/Tin Osp,Immersion Gold+OSP

Materials : Nelco, PTFE, TU862, TU872, FR4

Features : Designability, Maintainability, Testability

Min Laser Hole : 0.075mm

Copper Thickness : 0.3-12 oz

Payment Method : T/T

Whether to Support customization : Support

Logistics : Accept customer specified logistics

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PTFE PCB Layout Design Mixed Voltage Embedded Capacitor Carbon Ink

PCB Layout Design Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.


PCB Layout Design Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.5-17.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink


PCB Layout Design Introduction:

1. Under normal circumstances, all components should be arranged on the same side of the circuit board. Only when the top components are too dense, can some devices with limited height and low heat generation, such as chip resistors, chip capacitors, Chip IC, etc. are placed on the bottom layer.

2. On the premise of ensuring electrical performance, components should be placed on the grid and arranged in parallel or perpendicular to each other to be neat and beautiful. In general, components are not allowed to overlap; the arrangement of components should be compact, and components should be placed on the entire layout. The distribution is uniform and the density is consistent.

3. The minimum spacing between adjacent pad patterns of different components on the circuit board should be more than 1MM.

4. The distance from the edge of the circuit board is generally not less than 2MM. The best shape of the circuit board is a rectangle, and the aspect ratio is 3:2 or 4:3. When the surface size of the circuit board is greater than 200MM by 150MM, it should be considered that the circuit board can withstand Mechanical strength.

PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout


Product Tags:

PTFE PCB Layout Design

      

PCB Layout Design Mixed Voltage

      

PTFE Printed Circuit Board Layout

      
Quality PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout for sale

PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout Images

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